9903.91.05

2804.61.00.00 Containing by weight not less than 99.99 percent of silicon 3818.00.00 Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics 3818.00.00.10 Gallium arsenide wafers, doped 3818.00.00.20 Polycrystalline silicon wafers, doped 3818.00.00.30 Silicon carbide wafers, doped 3818.00.00.40 Round (circular) shaped, as described in statistical note 2 to this chapter 3818.00.00.45 Pseudo-square or rectangular in shape, as described in statistical note 3 to this chapter 3818.00.00.50 Other 3818.00.00.91 Other 8541.10.00 Diodes, other than photosensitive or light-emitting diodes (LED) 8541.10.00.40 Unmounted chips, dice and wafers 8541.10.00.50 Zener 8541.10.00.60 Microwave 8541.10.00.70 With a maximum current of 0.5 A or less 8541.10.00.80 Other 8541.21.00 With a dissipation rate of less than 1 W 8541.21.00.40 Unmounted chips, dice and wafers 8541.21.00.75 With an operating frequency not less than 100 MHz 8541.21.00.95 Other 8541.29.00 Other 8541.29.00.40 Unmounted chips, dice and wafers 8541.29.00.55 With an operating frequency less than 30 MHz 8541.29.00.65 With an operating frequency 30 MHz or greater but less than 30,000 MHz 8541.29.00.85 With an operating frequency 30,000 MHz or greater 8541.30.00 Thyristors, diacs and triacs, other than photosensitive devices 8541.30.00.40 Unmounted chips, dice and wafers 8541.30.00.80 Other 8541.49.10 Other diodes 8541.49.10.10 Unmounted chips, dice and wafers 8541.49.10.50 Other

N349448 June 10, 2025

The tariff classification of composite frames for photovoltaic (PV) solar panels from China

The items concerned are composite structural frames used in the manufacture/assembly of photovoltaic (PV) solar panels. These particular frames are produced using a pultrusion process that combines continuous glass fibers and polyurethane r